Rotable Parts Exchange serves as a comprehensive source for military products, aerospace equipment, and Microcircuit Memory items. You have expressed particular interest in part number PL7145443-00, a Lockheed Martin Corporation component we offer that is presented with the NSN 5962-01-385-9423 for straightforward identification and procurement. By completing and submitting the Request for Quote form provided on this page, you can obtain pricing details on this NSN part for your comparisons. Once our staff members receive and review your submitted information, a dedicated account manager will directly contact you with a response within 15 minutes or less.
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We strive to streamline the purchasing process and simplify it as much as possible, which includes providing detailed listings for all components to help customers pinpoint their exact needs. For instance, part number PL7145443-00 is manufactured by Lockheed Martin Corporation under the CAGE Code 90536. Additionally, by using the initial digits of the NSN 5962-01-385-9423, you can discover that this component is associated with the FSC 5962 Microcircuits Electronic. If you have any specific questions about our database, you may always give us a call or email, as we would be delighted to assist you however we can. Otherwise, we encourage you to secure a quote for part number PL7145443-00 at your earliest convenience.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-385-9423 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013859423 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | PAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.5 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
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